| PART |
Description |
Maker |
| RTP08050-10 |
This HPA Module is a high gain and Amplifier module for CDMA and LTE Repeater use.
|
RFHIC
|
| RFP-1962-32-27 |
HPA Module
|
RFHIC
|
| RFP-1882-32-27 |
HPA Module
|
RFHIC
|
| TGA2903-EPU-SG |
Packaged Ku band HPA
|
TriQuint Semiconductor
|
| TGA4501-EPU |
28-31 GHz Ka Band HPA
|
TriQuint Semiconductor
|
| TGA2503-EPU |
Ku Band HPA
13 - 17 GHz 2 Watt, 32dB Power Amplifier
|
TriQuint Semiconductor
|
| TGA4501-EPU |
28-31 GHz Ka Band HPA 28000 MHz - 31000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER
|
TriQuint Semiconductor,Inc.
TriQuint Semiconductor, Inc.
|
| EV42-160-22-SERIES EV44-100-22-SERIES EV44-160-22- |
TLC2555 Evaluation Module
TLC4545 Evaluation Module
TLC2551 Evaluation Module
CC1000DK-868/915 MHz Development Kit
CC2400DK Development Kit
TPA0172 Evaluation Module
Radiomodem 433 MHz
CC2400DBK Demonstration Board Kit
CC1000PP 433 MHz Plug and Play Module
Digital Data Capture and Analysis for High Speed, High Resolution A to D Converters
ADS1244 Evaluation Module
SN65HVD22EVM Evaluation Module
Peripheral IC 外围芯片
|
Infineon Technologies AG
NXP Semiconductors N.V.
Amphenol, Corp.
Xicon Passive Components
Electronic Theatre Controls, Inc.
|
| HYM72V8030GS-60 HYM72V8030GS-50 HYM72V8020GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Tools, Hand Crimp; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
SIEMENS A G
|
| HAS030ZG-A HAS030ZJ-A HAS030YG HAS030YG-A HAS030YH |
Filter Module with Resistor Network 腐殖酸系 30
Xfmr Module 腐殖酸系 30
Transformers Only Module
HAS SERIES - 30 WATT
|
Atmel, Corp.
Positronic Industries, Inc.
POWER-ONE[Power-One]
|
| HYM72V8010GS-60 HYM72V8010GS-50 HYM72V8000GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8米72位动态随机存储器模块
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Connector; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes 8M X 72 FAST PAGE DRAM MODULE, 50 ns, DMA168
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
|
